LKSoft News
LKSoft at SMT/HYBRID/PACKAGING 2009 in Nürnberg
March 31, 2009 - 15:24
LKSoft will present the new capabilities of IDA-STEP Electronics, Layer Stack Editor, 3D integration and more on the upcoming SMT/HYBRID/PACKAGING fair 2009 in Nürnberg, Germany. You can find us on the FED booth 233 from 5 to 7 Mai 2009, booth 9-233.
